Trends of Inspection & Reliability Technologies. Reliability for High Density Packaging & Interconnection of Electronics Apparatus.
نویسندگان
چکیده
منابع مشابه
Fatigue and Fracture Assessment for Reliability of Electronics Packaging
Modern electronics products move in the direction of complex, high density, high speed and also thinner and lighter for portability. Reliability of interconnection of electronics packaging has become critical issue. Major functions of electronic packaging are briefly discussed and failure mechanisms of electronic packaging are explained. Electronics packaging is subjected to mechanical vibratio...
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ژورنال
عنوان ژورنال: Journal of Japan Institute of Electronics Packaging
سال: 1999
ISSN: 1343-9677,1884-121X
DOI: 10.5104/jiep.2.269